Towards package opening detection at power-up by monitoring thermal dissipation

Julien Toulemont; Geoffrey Chancel; Fréderick Mailly; Philippe Maurine; Pascal Nouet

Paper 2024/1423

Towards package opening detection at power-up by monitoring thermal dissipation

Julien Toulemont, University of Montpellier

Geoffrey Chancel, University of Montpellier

Fréderick Mailly, University of Montpellier

Philippe Maurine, University of Montpellier

Pascal Nouet, University of Montpellier

Abstract

Among the various threats to secure ICs, many are semi-invasive in the sense that their application requires the removal of the package to gain access to either the front or back of the target IC. Despite this stringent application requirements, little attention is paid to embedded techniques aiming at checking the package's integrity. This paper explores the feasibility of verifying the package integrity of microcontrollers by examining their thermal dissipation capability.

Metadata

Available format(s): PDF
Category: Attacks and cryptanalysis
Publication info: Published elsewhere. Minor revision. Cascade
Keywords: Security hardware fault attacks reverse-engineering countermeasure thermal dissipation monitoring
Contact author(s): gchancel @ lirmm fr
frederick mailly @ umontpellier fr
pmaurine @ lirmm fr
nouet @ lirmm fr
History: 2024-09-11: approved; 2024-09-11: received; See all versions
Short URL: https://ia.cr/2024/1423
License: CC BY-NC

BibTeX

@misc{cryptoeprint:2024/1423,
      author = {Julien Toulemont and Geoffrey Chancel and Fréderick Mailly and Philippe Maurine and Pascal Nouet},
      title = {Towards package opening detection at power-up by monitoring thermal dissipation},
      howpublished = {Cryptology {ePrint} Archive, Paper 2024/1423},
      year = {2024},
      url = {https://eprint.iacr.org/2024/1423}
}