This work demonstrates that BBI (and indeed many other backside attacks) can be trivially performed on Wafer-Level Chip-Scale Packaging (WLCSP), which inherently expose the die backside. A low-cost ($15) design for the BBI tool is introduced, and validated with faults introduced on a STM32F415OG against code flow, RSA, and some initial results on various hardware block attacks are discussed.
Category / Keywords: applications / Fault Injection, Glitch Attacks, Body Biasing Injection Original Publication (with major differences): Smart Card Research and Advanced Application Conference (CARDIS) 2020 Date: received 5 Oct 2020, last revised 8 Oct 2020 Contact author: colin at oflynn com Available format(s): PDF | BibTeX Citation Note: Typo fixes from initial Version: 20201009:015815 (All versions of this report) Short URL: ia.cr/2020/1228